Surface Mount Technology (SMT):
• Components down to 0402 (0201 by special request)
• BGA, QFN, and other advanced packages
• Fine-pitch components and dense layouts
• Pick-and-place capacity up to 4000 CPH


Through-Hole Technology (THT):
• Manual soldering by experienced technicians
• Large connectors, transformers, and mechanical parts
• Mixed SMT/THT boards handled seamlessly
We handle boards that others find difficult: high component density, mixed technologies, or unusual form factors.
Your BOM arrives, we verify all parts and flag any issues before starting. No surprises halfway through assembly.
Precision stencil printing for consistent solder deposits. We use lead-free, RoHS-compliant materials.
Components placed with 0.02mm accuracy. Our operators handle placements that automated machines can't reach.
Controlled temperature profiles in our reflow and vapor-phase ovens. Perfect joints every time.
Hand-soldering for through-hole components. Years of experience with complex assemblies.
100% microscopic inspection. Every joint, every component, every board. No exceptions.
Send us your files and we'll give you exact pricing within 24 hours.
Email your Gerber files, BOM, and quantity requirements to: info@elprot.eu
Questions about your specific requirements? Call +371 26860566 to speak directly with our assembly team.